Offer type: full time
Salary: Depends on Experience
We are looking for an experienced engineer who will take ownership of specific equipment and processes in our prototype development lab to develop next generation flip chip packaging. This individual should have a thorough understanding of the typical operation of the equipment and processes as well as the extreme limits. This position requires a hands on individual as you will be responsible for recipe creation and development, establishing process controls, tool qualifications and documenting results. The ideal candidate will have 5-10 years of experience in semiconductor packaging with expertise in one or more of the following areas---Flip Chip Die Attach or Flip Chip Underfill. Must have recent Flip chip process development experience on high bump count large die flip chips.
Education Requirements: Degree in Mechanical Engineering, Material Science, Physics, Chemistry or related discipline.